Select each check box along the required products, and click "Plural Documents Request" button, and you can get all plural requested documents at once. Sort Products by CategorySort Products by Name Multilayer Ceramics Chip Packages for Surface Mounting Technology (SMT) NGK-ED provides Small-sized Ceramic Packages for Surface Mounting Technology, suitable for seam weld, Au/Sn or glass sealing method CMOS/CCD Package We design and propose for more flexible packages, with applying multilayer ceramic technologies. MEMS Package We propose package structure, in line with MEMS innovation. Optical Package (For PUMP's) In addition to conventional Butterfly style packages, MINIDILL types are joined to product line. Optical package(for TOSA) Fixed frequency : 10G TOSA ready, now approaching to 25G. Optical package(for Tunable) NGK-ED provides varieties of Tunable, from Butterfly to TOSA. Optical package(for Transmitter/Receiver) Recently data speed is further urged by digital coherent innovation. NGK-ED's multilayer ceramic gives a solution, with back-up of simulation technology. RF power device package Recently, higher heat dissipation performance is requested on packages for High RF power devices. NGK-ED have developed Cu Laminated H/S(CPC, SPC) used package, superior with high heat dissipation, to conventional Cu/W H/S used packages. High-speed package NGK-ED provides packages for High-Speed Device, supporting ubiquitous telecommunication network, with sophisticated design in streamline with high power frequency application. General pressed products By our outstanding powder pressing technologies, we can produce irregular shaped ceramic items. CMOS/CCD We propose more flexible package designing and proposal, with application of powder press ceramic technologies. Glass LID We provide various chip carriers, suitable for surface mounting, in reduced size with high density integration. We provide high and stable quality products, with excellent hermeticity and heat resistance. Epoxy LID Our ceramic lids precoated by cold cure type epoxy are suitable for cold cure, thermal sensitive chips encapsulation. CERDIP and Caps CERDIP type ceramic packages are mainly used for LSI devices, with excellent mechanical and thermal properties, and we provide volume products in stable quality. Piezoelectric products We can provide more condensed HIP material than normal one. Also, as piezoelectric products, we can provide stacked actuator for precise alignment determination, and bimorph actuator for valve application. DCB and AMB Substrates For Power Modules We produce from raw ceramic tape to DCB finishing, under integrated through-production line. LED Package For higher output power application, we provide LED packages with high heat dissipation, and high reliability, based on our own developed technologies. CERDIP and Caps CERDIP type ceramic packages are mainly used for LSI devices, with excellent mechanical and thermal properties, and we provide volume products in stable quality. CMOS/CCD We propose more flexible package designing and proposal, with application of powder press ceramic technologies. CMOS/CCD Package We design and propose for more flexible packages, with applying multilayer ceramic technologies. LED Package For higher output power application, we provide LED packages with high heat dissipation, and high reliability, based on our own developed technologies. MEMS Package We propose package structure, in line with MEMS innovation. RF power device package Recently, higher heat dissipation performance is requested on packages for High RF power devices. NGK-ED have developed Cu Laminated H/S(CPC, SPC) used package, superior with high heat dissipation, to conventional Cu/W H/S used packages. Multilayer Ceramics Chip Packages for Surface Mounting Technology (SMT) NGK-ED provides Small-sized Ceramic Packages for Surface Mounting Technology, suitable for seam weld, Au/Sn or glass sealing method Piezoelectric products We can provide more condensed HIP material than normal one. Also, as piezoelectric products, we can provide stacked actuator for precise alignment determination, and bimorph actuator for valve application. General pressed products By our outstanding powder pressing technologies, we can produce irregular shaped ceramic items. Glass LID We provide various chip carriers, suitable for surface mounting, in reduced size with high density integration. We provide high and stable quality products, with excellent hermeticity and heat resistance. Epoxy LID Our ceramic lids precoated by cold cure type epoxy are suitable for cold cure, thermal sensitive chips encapsulation. Insulating circuit boards We produce from raw ceramic tape to DCB finishing, under integrated through-production line. High-speed package NGK-ED provides packages for High-Speed Device, supporting ubiquitous telecommunication network, with sophisticated design in streamline with high power frequency application. Optical Package (For PUMP's) In addition to conventional Butterfly style packages, MINIDILL types are joined to product line. Optical package(for TOSA) Fixed frequency : 10G TOSA ready, now approaching to 25G. Optical package(for Tunable) NGK-ED provides varieties of Tunable, from Butterfly to TOSA. Optical package(for Receiver) Recently data speed is further urged by digital coherent innovation. NGK-ED's multilayer ceramic gives a solution, with back-up of simulation technology. Select each check box along the required products, and click "Request Document" button, and you can get all plural requested documents at once. Simulation Physical Property of Material
