NEWApril 01, 2022
We hereby inform the following change of Directors,
which were approved at our general stockholders' meeting on 01 April.
June 18, 2021
Change of Directors
April 23, 2021
We have closed the last purchase orders on Dielectric Ceramic Products listed on all (open) Catalogues on March 31, 2021.
July 1, 2020
We will discontinue the sale of dielectric products by 30th September once all the stock are exhausted.
If you would like to place an order/delivery collectively, please contact our sales staff as soon as possible.
June 22, 2020
We NGKED will discontinue accepting new purchase orders on Dielectric Ceramic Products Listed on All (Open) Catalogues, on July 31st, 2020
April 01, 2020
Change of Directors
With our own lamination technology, we respond to the growing demand for more sophisticated products.
By providing a variety of products, we contribute to the communication networks on which the modern world now depends.
We also offer power module-related products that use ceramic and copper.
Utilizing our advanced powder pressing technology, we offer pressed ceramics in a wide range of forms, which can be ordered in small quantities.
We supply various piezoelectric ceramics to accommodate our customers' needs.
CMOS/CCD Package
Multilayer Ceramics Chip Packages for Surface Mounting Technology (SMT)
MEMS Package
Optical Package (For PUMP's)
Optical package(for TOSA)
Optical package(for Tunable)
Optical package(for Receiver)
RF power device package
High-speed package
General pressed products
CMOS/CCD
Glass LID
Epoxy LID
CERDIP and Caps
Piezoelectric products
Noise filter
High frequency ceramic capacitor
DCB and AMB Substrates For Power Modules
LED Package
CERDIP and Caps
CMOS/CCD
CMOS/CCD Package
General pressed products
Glass LID
High frequency ceramic capacitor
High-speed package
Insulating circuit boards
LED Package
MEMS Package
Noise filter
Optical package(for PUMP)
Optical package(for Receiver)
Optical package(for TOSA)
Optical package(for Tunable)
Piezoelectric products
Epoxy LID
RF power device package
Multilayer Ceramics Chip Packages for Surface Mounting Technology (SMT)
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