Products
Ceramic Packages for RF Power Devices
Overview
Ceramic packages for RF power devices are used in power amplifiers for mobile phone macro base stations, aviation radar, and others. To address the ever-increasing data traffic in 5G wireless communication and others and to meet the power-saving needs, we offer high thermal dissipation heat sinks for GaN elements and optimum ceramic designs.
Features
High thermal dissipation
By brazing together high thermal dissipation materials, our products achieve high thermal dissipation.
High reliability
We offer high-reliability designs with chip thermal expansion taken into consideration.
High flatness
By matching thermal expansion between ceramics and heat sinks and by backside surface processing, we achieve high flatness.
Heat resistance
Our plating technology allows excellent plating characteristics to remain after heat exposure.
Product usage
Commercial use
- Macro base station PA
Industrial use
- Aviation, space, and satellite communications
- Radar
- Energy
Product specifications
| Flange | CuW, CuMo, CPC®*1, S-CMC®*2, diamond-based material, and others |
|---|---|
| Ceramics | High-strength HTCC*3 |
| Electrode | Tungsten |
| External dimension | ~50mm |
| Plating | Electrolytic Ni/Au, electrolytic Ni/Pd/Au |
*1 CPC®: radiator plate in which Cu-Mo composite is laminated with Cu layers at top and bottom (CPC® is a registered trademark of A.L.M.T. Corp.) *2 S-CMC®: Super CMC, a radiator plate in which multiple Cu and Mo layers are laminated (S-CMC® is a registered trademark of FJ Composite Co., Ltd.) *3 HTCC：High Temperature Co-fired Ceramic
Product Lineup
For the information on the products,
contact us via the following.
- Tokyo Sales Division 03-6779-5050 FAX:03-6779-5030