Products

Ceramic Lid for Resin Sealing

Overview

Ceramic lid with epoxy glue precoat is suitable for heat-sensitive devices.

Features

Function

  • Ceramic Lid with epoxy glue precoat achieves hermetic seal against gross leak.

Highlights

  • Ceramic Lid with epoxy glue precoat is formulated for sealing as low as 170 degree C.
  • Glue volume is adjustable and can be optimaized.
  • We can optimize gel time to suit customer's sealing conditions.
  • Lead-free materials help reduce environmental impact.

Product usage

LDMOS and GaN RF power devices

Product Lineup

For the information on the products,
contact us via the following.

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2701-1 Higashi-bun, Omine-cho, Mine-shi,
Yamaguchi Prefecture 759-2212, Japan

NGK ELECTRONICS DEVICES is a member of the NGK Group.