NGK ELECTRONICS DEVICES, INC.

NGK Insulators Group

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DCB and AMB Substrates For Power Modules

Insulated Circuit Board
Specification This DCB and AMB Substrates for Power Modules is provided by using ceramic substrate made from material of aluminum oxides family, directly bonded by copper (Direct Copper Bonding = DCB), without joint layer which might generate thermal resistance.
Advantage Thick copper plate (t : 0.2mm< ) can be bonded and suitable for ceramic substrates for power modules for high insulation durability against large electric current flowing, owing to ceramic characteristics with excellent insulation.

DCB Circuit Substrate

Technology Introduction

Application and Installation Examples

  • * High heat dissipation and High insulation resistant substrates, such as IGBT, IPM, SSR, MOS-FET etc.
  • * General use inverter, Machining tools, Robots, Wind power generator, Solar power generator, EV, HEV, Railway, Ships, Power LED, SSR

ZDA DCB Substrates, with superior performance.

Heat dissipation 96% alumina ZDA (patented) Aluminum Nitride
Cost ×
Heat dissipation ○ ※1
Strength
Substrate
Size
◎ ※2
General

Chip temperature reduces by 10℃

Consolidated to single substrate

Process Flow    In-house Consistent Production, ceramic tape through product finishing.

Material position : Superior in ZDA.

Available Material

AVAILABLE MATERIAL THICKNESS COMBINATIONS FOR DCB

  copper thicknesses mm
ceramic
thicknesses mm
  0.2 0.25 0.3 0.4 0.5・0.6
0.25 Al2O3
ZDA
Al2O3
ZDA
     
0.32 Al2O3
ZDA
Al2O3
ZDA
Al2O3
ZDA
ZDA ZDA
0.38 Al2O3
ZDA
Al2O3
ZDA
Al2O3
ZDA
ZDA  
0.63 Al2O3 Al2O3 Al2O3 Al2O3  
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